Wednesday , Sept. 25, 2024, 7:54 a.m.
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Technology / Fri, 31 May 2024 The Times of India

MediaTek Dimensity 7300 and Dimensity 7300X announced with AI capabilities: Details

MediaTek Dimensity 7300 and Dimensity 7300X: What’s newMediaTek Dimensity 7300 can offer 20% more energy efficiencyNew MediaTek chipsets come with MiraVision 955 built-inMediaTek has unveiled Dimensity 7300 and Dimensity 7300X 4nm chipsets. The duo is claimed by the company to offer ‘best-in-class power efficiency and excellent performance’. In a statement, MediaTek said that the Dimensity 7300 chipsets enable effortless multitasking, superior photography and accelerated gaming along with AI-enhanced computing. While the Dimensity 7300X is designed for foldable devices and provides support for dual displays.Both MediaTek Dimensity 7300 chipsets are equipped with an octa-core CPU consisting of 4X Arm Cortex-A78 cores operating at up to 2.5GHz paired with 4X Arm Cortex-A55 cores. Additionally, live focus photo performance is up to 1.3X faster and photo remastering is up to 1.5X faster than the Dimensity 7050.

MediaTek Dimensity 7300 and Dimensity 7300X: What’s new

MediaTek Dimensity 7300 can offer 20% more energy efficiency

New MediaTek chipsets come with MiraVision 955 built-in

MediaTek has unveiled Dimensity 7300 and Dimensity 7300X 4nm chipsets. The duo is claimed by the company to offer ‘best-in-class power efficiency and excellent performance’. In a statement, MediaTek said that the Dimensity 7300 chipsets enable effortless multitasking, superior photography and accelerated gaming along with AI-enhanced computing. While the Dimensity 7300X is designed for foldable devices and provides support for dual displays.Both MediaTek Dimensity 7300 chipsets are equipped with an octa-core CPU consisting of 4X Arm Cortex-A78 cores operating at up to 2.5GHz paired with 4X Arm Cortex-A55 cores. The 4nm process is said to provide up to 25% lower power consumption in the A78 cores compared to the Dimensity 7050.The all-new MediaTek chipsets come with the latest Arm Mali-G615 GPU and a suite of MediaTek HyperEngine optimizations to accelerate gaming experiences. Other features on the chipsets include a smart resource optimization and support for Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio.MediaTek says that the Dimensity 7300 chip can offer 20% faster FPS and 20% improved energy efficiency. The chipset boasts of MediaTek Imagiq 950, featuring a premium-grade 12-bit HDR-ISP with support for a 200MP main camera for improved camera performance. It also features precise noise reduction (MCNR), face detection (HWFD), and video HDR abilities, enabling users to capture stunning images and videos in any lighting. Additionally, live focus photo performance is up to 1.3X faster and photo remastering is up to 1.5X faster than the Dimensity 7050. Users can also record 4K HDR video with over 50% wider dynamic range on smartphones running the new chipset.With MediaTek’s MiraVision 955 built-in, the Dimensity 7300 SoCs support impressively detailed WFHD+ displays with 10-bit true color, along with support for global HDR standards, enhancing media streaming and playback. Additionally, the dedicated support for dual display flip phones on the Dimensity 7300X makes it easier for OEMs to meet the growing market demand for innovative form factors.They also boast of MediaTek APU 655 that significantly boosts AI task efficiency, along with MediaTek 5G UltraSave 3.0+ technology that provide between 13-30% greater power efficiency compared to competitor alternatives in common 5G sub-6GHz connectivity scenarios. The chipsets also have support for up to 3.27Gb/s 5G downlink via 3CC carrier aggregation, providing faster downlink speeds within urban and suburban environments.

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